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Aluminum Substrate PCB Thermal Conductivity (Cooling)

The heat dissipation of the aluminum substrate is based on the fact that the substrate material itself has better thermal conductivity, and the heat source is led out from the LED die, and the substrate is cooled by the LED die to the system circuit board, and then absorbed by the atmospheric environment to achieve the effect of heat dissipation.


In recent years, due to the development of aluminum substrates, the heat dissipation problem of system boards has been gradually improved, and even gradually developed into flexible flexible boards.


At present, the development trend of LED products can be observed from the power and size of LED products recently published by LED packaging manufacturers. High-power and small-size products are the development focus of the current LED industry, and all use aluminum-based heat-dissipating substrates. The way its LED die dissipates heat.


Therefore, the aluminum-based heat dissipation substrate has become a very important part in the structure of high-power, small-sized LED products.


Nowadays, the production technology of aluminum substrates is very mature. The circuit boards of early LED products are mostly PCB-based. However, with the increasing demand for high-power LEDs, the heat dissipation capability of PCB materials is limited, making it impossible to apply to its high-power products. In order to improve the heat dissipation problem of high-power LEDs, the high thermal conductivity aluminum substrate has achieved the purpose of heat dissipation of high-power products by utilizing the characteristics of better heat dissipation characteristics of the metal materials.


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