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Aluminum Substrate/Core PCB Features

Aluminum substrate (metal-based heat sink (including aluminum substrate, copper substrate, iron substrate)) is a low-alloyed Al-Mg-Si high-plastic alloy plate (see the figure below), which has good thermal conductivity and electrical insulation. Performance and machinability, the aluminum substrate is the same thickness and the same line width compared with the traditional FR-4. The aluminum substrate can carry higher current. The aluminum substrate can withstand voltage up to 4500V and the thermal conductivity is greater than 2.0. The industry is dominated by aluminum substrates.


Using surface mount technology (SMT);

Extremely efficient treatment of thermal diffusion in circuit design;

Reduce product operating temperature, increase product power density and reliability, and extend product life;

Reduce product size and reduce hardware and assembly costs;

Replace the fragile ceramic substrate for better mechanical durability.


Aluminum Substrate/Based/Core Copper Claded Laminate Structure


The aluminum-based copper clad laminate is a metal circuit board material composed of a copper foil, a thermally conductive insulating layer and a metal substrate, and its structure is divided into three layers:


Cireuitl.Layer circuit layer: equivalent to ordinary PCB copper clad, line copper foil thickness loz to 10oz.


DielcctricLayer insulation: The insulation is a low thermal resistance thermal insulation material. The thickness is from 0.003" to 0.006" inches, which is the core technology of aluminum-based copper clad laminates and has obtained UL certification. BaseLayer base: It is a metal substrate, usually aluminum or copper. Aluminum-based copper clad laminates and conventional epoxy glass cloth laminates.


PCB materials have advantages that are unmatched by other materials. Suitable for power component surface mount SMT public art.


No need for a heat sink, greatly reduced size, excellent heat dissipation, good insulation and mechanical properties.


The LED die substrate is mainly used as a medium for deriving thermal energy between the LED die and the system board, and is combined with the LED die by a wire bonding, eutectic or flip chip process. Based on the consideration of heat dissipation, the LED die substrates on the market are mainly ceramic substrates, and the circuit preparation methods can be roughly divided into three types: thick film ceramic substrate, low temperature co-fired multilayer ceramic, and thin film ceramic substrate. For high-power LED components, a thick film or a low-temperature co-fired ceramic substrate is used as a die-dissipating substrate, and the LED die is bonded to the ceramic substrate by a gold wire. As mentioned in the introduction, this gold wire connection limits the effectiveness of heat dissipation along the electrode contacts. Therefore, major manufacturers at home and abroad are working hard to solve this problem. There are two solutions. One is to find a substrate material with a high heat dissipation coefficient instead of alumina, and includes a germanium substrate, a tantalum carbide substrate, an anodized aluminum substrate or an aluminum nitride substrate, wherein the tantalum and the tantalum carbide substrate are made of a material semiconductor. The characteristics make it encounter the more severe test at the present stage, and the anodized aluminum substrate is easily turned on due to the insufficient strength of the anodized oxide layer, which makes it limited in practical application, and thus, at this stage The more mature and generally accepted is the use of aluminum nitride as the heat sink substrate; however, it is currently limited by the aluminum nitride substrate not suitable for traditional thick film process. (Materials must be heat treated at 850 °C after silver paste printing, make it a material reliability problem). Therefore, the aluminum nitride substrate line needs to be prepared by a thin film process. The aluminum nitride substrate prepared by the thin film process greatly accelerates the heat from the LED die to the system board through the substrate material, thereby greatly reducing the burden of heat from the LED die to the system board through the metal wire, thereby achieving high heat dissipation effect.


Edited by Global Quick Turn PCB Limited, GQTPCB produces best aluminum substrate PCB prototype and batch aluminum based PCB for customers all over the world.





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