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How Aluminum Substrate PCB Circuit Board Works

The surface of the power device is mounted on the circuit layer, and the heat generated during operation of the device is quickly conducted to the metal base layer through the insulating layer, and then the heat is transferred by the metal base layer to achieve heat dissipation of the device.


Compared with the conventional FR-4, the aluminum substrate can minimize the thermal resistance and make the aluminum substrate have excellent thermal conductivity. Compared with the thick film ceramic circuit, its mechanical properties are extremely excellent.


In addition, aluminum substrates have the following unique advantages:


Meet RoHs requirements;


More suitable for SMT process;


Extremely effective treatment of thermal diffusion in the circuit board design, thereby reducing module operating temperature, extending service life, increasing power density and reliability;


Reduce the assembly of heat sinks and other hardware (including thermal interface materials), reduce product size, reduce hardware and assembly costs; optimize power circuit and control circuit combination; replaces fragile ceramic substrates for better mechanical durability




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